Equipment Introduction
The product named Mono807 Diamond Wire mono-silicon cutting machine is a machine using a diamond wire to cut and process mono-silicon ingots.It employs a processing technique in which silicon ingots are cut into sections with head and tailing ends cut off through a diamond wire reciprocating at high speed and complex control system. This machine is mainly used for processing mono-silicon , can simultaneously cause seven cuts and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy.
Equipment Feature:
· Cutting stick length up to 4500mm
· Everything can be cut 7 knife edge
· 30 minutes to complete a cutting
Euipment Advantage:
· Low cutting loss
· High efficiency
· Reliable function
Technical Parameter:
|
Item |
Parameters |
|
Workpiece diameter |
Φ150～Φ260 mm |
|
Workpiece length |
1000～4500 mm |
|
Wire diameter |
0.35～0.42mm |
|
Processing quantity |
One pcs |
|
Segment length |
200-700mm |
|
Cutting blade quantity |
7刀口 Seven blade |
|
Feed speed |
0～300 mm/min |
|
Wire speed |
0~25m/s |
|
Wire length |
10000m(0.35mm)；7000m(0.42mm) |
|
Wire tension |
10～130 N |
|
Cutting time |
12min/ single blade |
|
Wire consume |
25m/（pcs） |
|
Dimensions |
6402×1262×2263 mm |
|
Worktable dimensions |
4520×864×775 mm |
|
Machine weight |
~9900 kg ( single-station) |
