Equipment Introduction
The product named Poly306 Diamond Wire Multi-silicon Cutting Machine is a machine using a diamond wire to cut and process muiti-silicon brick. It employs a processing technique in which silicon bricks are cut into sections through a diamond wire reciprocating at high speed. This machine is mainly used for processing multi-silicon , can simultaneously cut several bricks and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy,low footprint.,convenient in operation, and also can be configured with machine hand to reduce workload or can be configured with robot for automatic production line.
Technical Parameter:
|
Items |
Parameters |
|
Workpiece size |
□156mm×L450mm |
|
Wire diameter |
0.3mm～0.42mm |
|
Feed speed |
1～30mm/min |
|
Wire speed |
0~25m/s |
|
Acceleration time |
3s |
|
Wire consume |
3m/lump |
|
Processing quantity |
6 lump |
|
Cutting time |
8min |
|
Worktable moving speed |
0～300mm/min |
|
Max .wire storage |
10000m（0.35mm）；7000m(0.42mm) |
|
Wire tension |
10～130N |
|
Dimensions |
3400×2600×1900mm |
|
Machine weight |
~6000kg |
