Equipment Introduction
The equipment is up to the international advanced level, taking electroplated diamond wire as the cutting network, using silicon feed down way, using servo synchronous control network for high-speed cutting.
· 60μmultrafine electroplated wire for cutting
· Servo synchronous high-speed cutting
· The silicon length 680mm
· Max.speed 1500m/min
· Small Center distance
Euipment Advantage:
· Low knife loss
· Low cutting cost
· Low cutting time
· High speed and high capacity
· High silicon wafer yield
Technical Parameter：
|
Items |
Parameters |
|
Max workpiece size |
□156mm×L680mm |
|
Wire moving mode |
One way or Reciprocating |
|
Max. speed |
1500m/min |
|
Centre distance |
385mm |
|
Wafering mode |
Downward cutting |
|
Feed speed |
0.1～2.5mm/min |
|
Fast forward Fast backward |
50～500mm/min |
|
Max.wire storage |
200km |
|
Wire tension |
4～20N |
|
Cooling water Temp. |
11±1℃ |
|
Pressure |
0.4～0.6MPa |
|
Dimensions |
5050×2078×3090mm |
|
Machine weight |
~12000kg |
|
Main roller weight |
115kg /（pcs） |
