GC-KM202Monocrystal Squaring & Grinding Machine
The product can be used in many links of silicon wafer manufacturing process, including the squaring, chamfering, grinding, and polishing. The silicon rods can be loaded and clamped in one step. Via accurate positioning of the high precision turntable in the circulation of operation stations, all processing links can be completed, positioned precisely by the high precision turntable during process to complete all steps, 0.2mm square margin of single edge, minimizing silicon loss. Squaring margin
Product Parameters
Squaring margin |
≤0.2mm (single side) |
Processing efficiency |
29min (830mm long M10 arc bar) |
Dimensional tolerance |
+0.04mm |
Surface Roughness |
Ra≤0.1μm |
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