GC-LMKC01Slicer Wire Guide Roller Grooving Machine

To process the WGR, the grooving machine is the core processing equipment in the slicing process of silicon wafers. Gaoce WGR grooving machine GC-LMKC01 adopts a high-performance ultrafast laser system. With a smaller heat affected zone, the laser cutting is a non-contact processing method reducing the radial pressure on the WGR, effectively improving the grooving accuracy and meeting the high-precision requirements of WGR grooving during silicon wafer slicing. It can meet the different types and process requirements of ultra-fine diamond wire for the WGR grooving, which can further improve the slicing yield of silicon wafers.