GC-TD804Silicon Carbide Chamfering Machine
This product is suitable for edge chamfering processing equipment of silicon carbide wafers. This equipment is compatible with 4-inch, 6-inch and 8-inch sizes, and has the capability to process the OF (Orientation Flat) surface. The optional NOTCH groove processing function is provided. Furthermore, this equipment features the high processing accuracy, high processing efficiency and stable operation.
Product Parameters
Host size and weight |
2,250 (L)*1,650 (W)*2,600 (H) ㎜; 3,000 kg |
Wafer size |
4*6*8 in |
Wafer thickness |
300 μm~1,500 μm |
Workstation |
Dual workstation |
Wafer reference surface shape |
OF/Notch (Notch optional) |
Equipment size |
2,250 (W)*1,650 (D)*2,600 (H) |
Grinding X/Y/Z axis accuracy |
X/Y/Z axis accuracy: ±1 μm |
Ceramic suction cup plane accuracy: ≤3 μm | |
Accuracy of the grinding bench spindle end face and radial direction: ±1 μm | |
Accuracy of the grinding wheel spindle end face and radial direction: ±1 μm | |
Outer diameter of the grinding wheel |
Φ202 mm |
Inner diameter of the grinding wheel mounting |
Φ30 mm |
Grinding wheel thickness |
20 mm |
Rotation speed of the grinding wheel |
0-4,000 r/min (according to customer's demands) |
Rotation speed of the Notch grinding wheel |
0-100,000 r/min (according to customer's demands) |
Grinding wheel mode |
T, R, TT, RR, TR type, etc. |
|
Wafer thickness measurement (Non-contact or contact type) |
Accuracy of the repeated thickness measurement: ±2 μm; |
Measurement number: One point in the center | |
Cleaning method |
Rotation cleaning |
Drying method |
Centrifugal drying |
Loading/unloading section |
Number of boxes: 4 |
Number of slots: 25 (adjustable) |
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