GC-SCDW8300Silicon Carbide Wafering Machine
This product is a dedicated multi-wire cutting equipment for diamond wire cutting of silicon carbide ingots, featuring adjustable wheelbase, workpiece oscillation, low cutting material loss, and low wire consumption. Combined with dedicated diamond wire, high-precision tension control system, and high-speed cutting technology, it achieves stable cutting of 6-8 inch crystals with high efficiency and high quality.
Product Parameters
Max. Workpiece Size |
mm |
6～8” ×L300 |
Wire Feeding Direction |
One-way feeding /two-way feeding |
|
Max. Wire Speed |
m/min |
3000 |
Cutting Method |
Downwards cutting |
|
Max. Swing Angle |
mm/min |
50～500 |
Max. Swing Speed |
。 |
±10 |
Max. Wire Reserve |
Km |
120 |
Dimension (L x W x H) |
mm |
About 4880×2100×3100 |
Equipment Weight |
Kg |
About 14000 |
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