GC-SEWS824 Semiconductor Single-wire Cropper
This product is a special equipment for cutting semiconductor monocrystalline silicon rods. It can process silicon rods with diameter of 8~24 inches and maximum processing length of 2600mm. This equipment uses diamond wire for cutting, removing head/tail, and cutting of samples, with characteristics of high cutting efficiency and good section quality.
Product Parameters
|
Machine profile |
Equipment Size |
About.5000mm×2560mm×2740mm (LxWxH) |
Equipment Weight |
About.5500kg |
|
|
Specification of silicon rod |
Length of Silicon Rod |
300~2000mm (excluding head/tall, cutting from head to tail without reversing) |
Diameter of Silicon Rod |
φ200~φ600mm |
|
Processing Quantity |
1 piece/block |
|
Segment Length |
150mm~400mm (manual cutting for those below 300mm) |
|
Number of Cutting |
1 Knife edge/knife |
|
Sample Thickness |
2～15mm |
|
|
Cutting system |
Feeding Drive |
Servo motor, lead screws lifting |
Moving Speed of Cutting Head |
0～900mm/min, no grade for adjustment |
|
Cutting Feed Speed |
0~20mm/min (set based on diameter of silicon rod) |
|
Diameter of Cutting Wire |
φ0.42mm |
|
Cutting Time |
Complete one cut of 18” silicon rod within 90 minutes in average (adjustable depending on the cutting quality) |
|
Cutting tension |
Tension of Cutting Wire |
0～120N |
|
Equipment system |
Power Supply for bus |
380V±10%AC,50Hz±1Hz |
Power Load |
14KVA |
Related Products
Sustainable Development
Related Solutions
Get Quote
Fill in a brief message and we will contact you as soon as possible~