GC-SEDW812 Semiconductor Diamond Wire Slicer Machine
The product is a special processing equipment that uses diamond wire to cut semiconductor single crystal silicon sheet. It can process silicon rod diameter compatible with 8", 12" and the maximum processing length 450mm (crystal deviation Angle ≤4°). It has the characteristics of small silicon material loss, good processing quality, high cutting efficiency and good stability.
Product Parameters
Max. Workpiece Size |
φ301xL450x1(crystal orientation declination≤4°)mm |
Incoming direction |
One-way incoming/two-way incoming |
Max. wire Speed |
2100m/min |
Cutting Method |
Downwards cutting |
Cutting Speed |
0~3mm/min |
Fast Forward/ rewing |
30~500mm/min |
Max.Wire reserve |
50km |
Equipment Size(LxW×H) |
About.6000×2600×3000mm |
Equipment Weight |
About.14000kg |
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