Grinding Wheels for Chamfering Grinding of Semiconductor Wafer
Mainly used for chamfering and grinding of various sizes of silicon wafers, with groove shapes and quantities designed as required, good shape, long service life, no defect of workpiece.
Product Parameters
Shape code |
Conventional specification/mm |
|||
Diameter, D |
Thickness, T |
Aperture, H |
Grooved, G |
|
1A1V |
150 |
10 |
30 |
Designed as required |
9A1V |
202 |
20 |
30 |
Designed as required |
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